At present we take a look on the Inspur i24M6. That is the corporate’s 2U 4-node (2U4N) server based mostly on the third Gen Intel Xeon Scalable “Ice Lake” sequence of processors. Whereas Intel has set a date for its Sapphire Rapids launch, we anticipate that Ice Lake servers will nonetheless promote properly into the subsequent 12 months for quite a lot of causes we’ll talk about at that launch. Within the meantime, allow us to check out Inspur’s high-density Ice Lake server answer.
Inspur i24M6 2U4N Node Overview
Usually we begin with the chassis in these 2U4N critiques, however because the chassis is pretty just like the Inspur i24 we reviewed beforehand, we needed to as an alternative begin with the node overview. As one can see, every node on this 2U4N platform has twin Intel Xeon processors and room for I/O.
One thing that Inspur does, that some aggressive options don’t, is to make the most of high-density connectors for knowledge and energy. This frees up airflow within the chassis and is a extra elegant answer.
Contained in the system, now we have two third Era Intel Xeon Scalable processors, codenamed “Ice Lake”. Every socket is flanked by eight DIMM slots for DDR4-3200 reminiscence in a 1 DIMM per channel configuration. Whereas we achieve node density within the 2U4N kind issue, we lose half of the DIMM capability on account of the extra slender kind issue.
Within the system, Inspur gives plenty of processors. Intel Xeon Platinum 8352Y. These 205W TDP CPUs are actually attention-grabbing. At their base configuration, they provide 32 cores at a 2.2GHz base and a 3.4GHz turbo. One can choose a 24-core configuration with a 2.3GHz base and a 185W TDP or a 16-core configuration with a 2.6GHz base clock on the identical 185W TDP. Intel has been working to simplify its provide chain by providing choices like this the place a single SKU might be ordered and put in, then the processor custom-made on the final second.
The ASPEED AST2500 BMC is the administration processor on the motherboard.
One smaller characteristic is that subsequent to the PCH, we get twin microSD card slots. We now have began to see the recognition of utilizing microSD playing cards wane, however many nonetheless use them.
For networking, now we have an OCP NIC 3.0 slot. On this system, now we have twin 25GbE Intel E810 NICs.
Our system didn’t have a riser above the OCP NIC 3.0 slot, however we will see the slot and mounting factors for the riser. A part of that’s simply as a result of thermal constraints of the system.
As regards to thermal constraints, that is now the heatsink on the second CPU. We’re now not within the period the place two heatsinks over the CPUs in serial are adequate. As a substitute, we want a heatsink with a second extension part drawing cool air from close to the DIMM slots (the opposite facet is for growth card cooling.) This design additionally blocks utilizing a second growth slot within the chassis.
For a greater view of this wonderful heatsink, right here it’s by itself. Whereas the entrance heatsink appears to be like pretty mundane, this rear heatsink is clearly a response to the challenges of air cooling as TDPs rise.
The entrance SSDs on programs like this are usually used for storage. Because of this, we see an even bigger push in the direction of inside M.2 SSDs for boot. That’s what now we have right here on the facet reverse the big heatsink.
Inspur has a M.2 boot card with two M.2 SSDs in M.2 2280 or M.2 22110 sizes. This provides the chance for mirrored redundant boot gadgets internally leaving the entrance bays for high-performance storage.
The rear of the unit has a administration port as normal however makes use of a high-density breakout connection for USB and video connectivity.
Subsequent, allow us to check out the chassis.
