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AMD Particulars Technique to Drive


SANTA CLARA, Calif., June 09, 2022 (GLOBE NEWSWIRE) — Right now at its Monetary Analyst Day, AMD ( AMD) outlined its technique to ship its subsequent section of progress pushed by the corporate’s expanded portfolio of high-performance and adaptive computing merchandise spanning the info middle, embedded, consumer, and gaming markets.

“From the cloud and PCs to communications and clever endpoints, AMD’s high-performance and adaptive computing options play an more and more bigger function in shaping the capabilities of practically each service and product defining the way forward for computing in the present day,” stated Dr. Lisa Su, AMD chair and CEO. “The shut of our transformational acquisition of Xilinx and our expanded portfolio of management compute engines present AMD with important alternatives to ship continued robust income progress with compelling shareholder returns as we seize a bigger share of the various $300 billion marketplace for our high-performance and adaptive merchandise.”

Expertise and Product Portfolio Updates
AMD introduced expanded multi-generational CPU core, graphics, and adaptive computing structure roadmaps together with new particulars on the:

  • “Zen 4” CPU core anticipated to energy the world’s first high-performance 5nm x86 CPUs later this yr. “Zen 4” is predicted to extend IPC 8%-10%1 and ship greater than a 25% improve in performance-per-watt2 and 35% total efficiency improve in comparison with “Zen 3” when working desktop purposes3.
  • “Zen 5” CPU core deliberate for 2024, which is constructed from the bottom as much as ship efficiency and effectivity management throughout a broad vary of workloads and options and consists of optimizations for AI and machine studying.
  • AMD RDNA™ 3 gaming structure that mixes a chiplet design, subsequent era AMD Infinity Cache™ know-how, modern 5nm manufacturing know-how, and different enhancements to ship greater than 50% higher performance-per-watt in comparison with the prior era4.
  • 4th Gen Infinity Structure that additional extends AMD’s management modular SoC design method with a high-speed interconnect, permitting seamless integration of each AMD IP and threerd get together chiplets to allow a wholly new class of high-performance and adaptive processors and offering a custom-ready heterogenous computing platform.
  • AMD CDNA™ 3 structure, which mixes 5nm chiplets, 3D die stacking, 4th era Infinity Structure, next-generation AMD Infinity Cache™ know-how, and HBM reminiscence in a single package deal with a unified reminiscence programming mannequin. The primary AMD CDNA 3 architecture-based merchandise are deliberate for 2023 and are anticipated to ship greater than 5X higher performance-per-watt in comparison with AMD CDNA 2 structure on AI coaching workloads5.
  • AMD XDNA, the foundational structure IP from Xilinx that consists of key applied sciences together with the FPGA cloth and AI Engine (AIE). The FPGA cloth combines an adaptive interconnect with FPGA logic and native reminiscence, whereas the AIE gives a dataflow structure optimized for top efficiency and vitality environment friendly AI and sign processing purposes. AMD plans to combine AMD XDNA IP throughout a number of merchandise sooner or later, beginning with AMD Ryzen™ processors deliberate for 2023.

Expanded Information Heart Options Portfolio
AMD revealed an expanded portfolio of high-performance, next-generation CPUs, accelerators, information processing items (DPUs), and adaptive computing merchandise optimized for a number of workloads, together with:

  • 4th Gen AMD EPYC™ processors powered by “Zen 4” and “Zen 4c” cores.
    • “Genoa” powered by “Zen 4”: On-track to launch in This fall 2022 as the very best efficiency basic goal server processor accessible, with the top-of-stack product delivering higher than 75% quicker enterprise Java® efficiency in comparison with top-of-stack 3rd Gen EPYC processors6.
    • “Bergamo” powered by “Zen 4c”: Anticipated to be the very best efficiency server processors for cloud native computing, providing greater than double the container density of threerd Gen EPYC processors at their launch deliberate for the primary half of 20237.
    • “Genoa-X” powered by “Zen 4”: An optimized model of 4th Gen EPYC processors with AMD 3D V-Cache™ know-how to allow management efficiency in relational database and technical computing workloads8.
    • “Siena” powered by “Zen 4”: The primary AMD EPYC processor optimized for clever edge and communications deployments that require larger compute densities in a value and energy optimized platform.
  • AMD Intuition™ MI300 accelerators, the world’s first information middle APUs, anticipated to ship a higher than 8x improve in AI coaching efficiency in comparison with the AMD Intuition MI200 accelerator9. MI300 accelerators leverage a groundbreaking 3D chiplet design combining AMD CDNA 3 GPU, “Zen 4” CPU, cache reminiscence, and HBM chiplets which might be designed to offer management reminiscence bandwidth and software latency for AI coaching and HPC workloads.
  • AMD Pensando DPUs that mix a sturdy software program stack with “zero belief safety” all through and an industry-leading packet processor to create the world’s most clever and performant DPU, which is already deployed at scale throughout cloud and enterprise clients.
  • Alveo™ SmartNICs deployed by hyperscale clients to speed up {custom} workloads and lengthen confidential computing to the networking interface.

Accelerating Management in Pervasive AI
AMD is uniquely positioned with its broad product portfolio and expertise serving numerous embedded markets to assist clients develop and deploy purposes with a number of types of AI.

The transformative acquisition of Xilinx gives AMD with an unmatched set of {hardware} and software program capabilities, integrating the management Xilinx AI Engine (AIE) throughout AMD Ryzen, AMD EPYC and Xilinx Versal™ merchandise for small and mid-size AI fashions to enhance next-generation AMD Intuition accelerators and adaptive SoCs, enabling management efficiency on scale-out coaching and inference workloads.

To unify AI programming instruments, AMD additionally introduced a multi-generation Unified AI Software program roadmap that may permit AI builders to program throughout its CPU, GPU, and Adaptive SoC product portfolio from machine studying (ML) frameworks with the identical set of instruments and pre-optimized fashions.

Increasing PC Management
AMD showcased its management within the international PC market, detailing the way it continues to deepen OEM partnerships and drive continued progress throughout premium, gaming, and business markets, and supplied a preview of its consumer roadmap over the subsequent a number of years, together with:

  • The “Phoenix Level” cellular processor deliberate for 2023 will deliver collectively the AMD “Zen 4” core structure with AMD RDNA 3 graphics structure and AIE, adopted by the “Strix Level” processor deliberate for 2024. “Phoenix Level” improvements embrace the AIE inference accelerator, picture sign processor, superior show for refresh and response, AMD chiplet structure, and excessive energy administration.
  • The “Zen 4”-based Ryzen 7000 Collection desktop processors, that are anticipated to ship quicker clock speeds and higher single and multi-threaded efficiency in comparison with Ryzen 6000 processors10, will likely be adopted by “Zen 5”-based “Granite Ridge” processors.

Driving Graphics Momentum
AMD introduced the newest developments designed to proceed bringing world-class graphics options to clients worldwide, together with:

  • “Navi 3x” merchandise are anticipated to launch later this yr, constructed on the next-generation AMD RDNA 3 gaming structure.
  • Greater than 50 new gaming PC platforms are anticipated to launch in 2022, elevating gaming to new ranges of efficiency and visible constancy by combining AMD Radeon™ RX Collection graphics with AMD Ryzen processors.
  • AMD expanded its management place within the gaming console house with the addition of Valve’s Steam Deck™ gaming handheld, powered by AMD “Zen 2” architecture- primarily based processors and AMD RDNA 2 architecture-based graphics.
  • New progress alternatives in 2022 and past, together with offering a variety of graphics applied sciences to speed up next-generation metaverse purposes, starting from 3D content material creation past video games and flicks, to cloud gaming and interactivity inside metaverse environments.

New Monetary Reporting Segments
Beginning with second quarter 2022 outcomes, AMD is updating its monetary reporting segments to align with its strategic finish markets:

  • Information Heart: Together with server CPUs, information middle GPUs, and the parts of Xilinx income associated to the info middle enterprise
  • Embedded: Together with the Xilinx embedded enterprise plus the AMD embedded enterprise
  • Shopper: Together with the standard desktop and pocket book PC enterprise
  • Gaming: Together with the discrete graphics gaming enterprise and the semi-custom recreation console enterprise.

Collectively We Advance
To enrich the evolution of its strategic finish markets and management product portfolio, AMD additionally showcased a brand new evolution of its model. The brand new model platform, “collectively we advance_” demonstrates how, along with its companions, clients, and workers, AMD is advancing innovation to create options to the world’s hardest challenges. The brand new model marketing campaign is the biggest in AMD historical past and sees the AMD arrow mark changing into extra distinguished in all communications property, illustrating how pervasive AMD know-how is by powering massive, numerous, and rising markets.

Supporting Assets

About AMD
For greater than 50 years AMD has pushed innovation in high-performance computing, graphics, and visualization applied sciences. AMD workers are targeted on constructing management high-performance and adaptive merchandise that push the boundaries of what’s potential. Billions of individuals, main Fortune 500 companies, and cutting-edge scientific analysis establishments all over the world depend on AMD know-how day by day to enhance how they dwell, work, and play. For extra details about how AMD is enabling in the present day and galvanizing tomorrow, go to the AMD ( AMD) web site, weblog, LinkedIn, and Twitter pages.

Cautionary Assertion
This press launch comprises forward-looking statements regarding Superior Micro Units, Inc. (AMD, Monetary) such because the options, performance, efficiency, availability, timing and anticipated advantages of AMD merchandise; AMD’s subsequent section of progress; AMD’s important alternative to ship robust progress and shareholder returns over the subsequent 5 years; anticipated advantages of AMD’s acquisition of Pensando Techniques; and AMD’s new progress alternatives in 2022 and past, that are made pursuant to the Protected Harbor provisions of the Non-public Securities Litigation Reform Act of 1995. Ahead-looking statements are generally recognized by phrases corresponding to “would,” “could,” “expects,” “believes,” “plans,” “intends,” “tasks” and different phrases with comparable that means. Traders are cautioned that the forward-looking statements on this press launch are primarily based on present beliefs, assumptions and expectations, converse solely as of the date of this press launch and contain dangers and uncertainties that might trigger precise outcomes to vary materially from present expectations. Such statements are topic to sure identified and unknown dangers and uncertainties, lots of that are troublesome to foretell and usually past AMD’s management, that might trigger precise outcomes and different future occasions to vary materially from these expressed in, or implied or projected by, the forward-looking info and statements. Materials elements that might trigger precise outcomes to vary materially from present expectations embrace, with out limitation, the next: Intel Company’s dominance of the microprocessor market and its aggressive enterprise practices; international financial uncertainty; lack of a big buyer; affect of the COVID-19 pandemic on AMD’s enterprise, monetary situation and outcomes of operations; aggressive markets wherein AMD’s merchandise are offered; market situations of the industries wherein AMD merchandise are offered; cyclical nature of the semiconductor {industry}; quarterly and seasonal gross sales patterns; AMD’s capability to adequately shield its know-how or different mental property; unfavorable foreign money alternate price fluctuations; capability of third get together producers to fabricate AMD’s merchandise on a well timed foundation in adequate portions and utilizing aggressive applied sciences; availability of important tools, supplies, substrates or manufacturing processes; capability to realize anticipated manufacturing yields for AMD’s merchandise; AMD’s capability to introduce merchandise on a well timed foundation with anticipated options and efficiency ranges; AMD’s capability to generate income from its semi-custom SoC merchandise; potential safety vulnerabilities; potential safety incidents together with IT outages, information loss, information breaches and cyber-attacks; uncertainties involving the ordering and cargo of AMD’s merchandise; AMD’s reliance on third-party mental property to design and introduce new merchandise in a well timed method; AMD’s reliance on third-party corporations for design, manufacture and provide of motherboards, software program and different pc platform elements; AMD’s reliance on Microsoft and different software program distributors’ help to design and develop software program to run on AMD’s merchandise; AMD’s reliance on third-party distributors and add-in-board companions; affect of modification or interruption of AMD’s inside enterprise processes and data techniques; compatibility of AMD’s merchandise with some or all industry-standard software program and {hardware}; prices associated to faulty merchandise; effectivity of AMD’s provide chain; AMD’s capability to depend on third get together supply-chain logistics capabilities; AMD’s capability to successfully management gross sales of its merchandise on the grey market; affect of presidency actions and rules corresponding to export administration rules, tariffs and commerce safety measures; AMD’s capability to understand its deferred tax property; potential tax liabilities; present and future claims and litigation; affect of environmental legal guidelines, battle minerals-related provisions and different legal guidelines or rules; affect of acquisitions, joint ventures and/or investments on AMD’s enterprise, and skill to combine acquired companies, corresponding to Xilinx; affect of any impairment of the mixed firm’s property on the mixed firm’s monetary place and outcomes of operation; restrictions imposed by agreements governing AMD’s notes, the ensures of Xilinx’s notes and the revolving credit score facility; AMD’s indebtedness; AMD’s capability to generate adequate money to satisfy its working capital necessities or generate adequate income and working money movement to make all of its deliberate R&D or strategic investments; political, authorized, financial dangers and pure disasters; future impairments of goodwill and know-how license purchases; AMD’s capability to draw and retain certified personnel; AMD’s inventory worth volatility; and worldwide political situations. Traders are urged to assessment intimately the dangers and uncertainties in AMD’s Securities and Trade Fee filings, together with however not restricted to AMD’s most up-to-date stories on Types 10-Okay and 10-Q.

©2022 Superior Micro Units, Inc. All rights reserved. AMD, the AMD Arrow brand, AMD CDNA, EPYC, Infinity Cache, Radeon, RDNA, Ryzen and combos thereof, are logos of Superior Micro Units, Inc. Different names are for informational functions solely and could also be logos of their respective house owners.


1 Z4-001: IPC uplift primarily based on the common of estimated/revealed 2017 SPECint® and 2017 SPECfp® scores and inside estimates/testing on Cinebench R23 1T and Geekbench 5 1T.for “Zen4” and “Zen 3” processors
2 Z4-003: Testing as of Might 31, 2022, by AMD Efficiency Labs. Energy measured at CPU socket solely (Watts), CPU efficiency (“factors”) measured with Cinebench R23 nT. AMD Ryzen 9 5950X System: AMD Reference X570 Motherboard, 2×8 DDR4-3200. AMD Ryzen 7000 Collection: AMD Reference X670 Motherboard, Ryzen 7000 Collection 16-core pre-production processor pattern, 2x16GB DDR5-5200. All techniques configured with Radeon™ RX 6950XT GPU (driver: 22.10 Prime), Home windows 11 Construct 22000.593, Samsung 980 Professional 1TB SSD, Asetek 280MM liquid cooler. Outcomes could differ when last merchandise are launched in market.
3 Z4-004: Testing as of Might 5, 2022, by AMD Efficiency Labs. Single-thread efficiency evaluated with Cinebench R23 1T. AMD Ryzen 9 5950X System: ASUS ROG Crosshair VIII Hero X570, 2×8 DDR4-3600C16. AMD Ryzen 7000 Collection: AMD Reference X670 Motherboard, Ryzen 7000 Collection 16-core pre-production processor pattern, 2x16GB DDR5-6000CL30. All techniques configured with Radeon™ RX 6950XT GPU (driver: 22.10 Prime), Home windows 11 Construct 22000.593, Samsung 980 Professional 1TB SSD, Asetek 280MM liquid cooler. Outcomes could differ when last merchandise are launched in market.
4 Based mostly on preliminary inside engineering estimates. Precise outcomes topic to vary
5 MI300-004: Measurements by AMD Efficiency Labs June 4, 2022. MI250X (560W) FP16 (306.4 estimated delivered TFLOPS primarily based on 80% of peak theoretical floating-point efficiency). MI300 FP8 efficiency primarily based on preliminary estimates and expectations. MI300 TDP energy primarily based on preliminary projections. Ultimate efficiency could differ
6 SP5-005: Server-side Java multiJVM workload demo comparability primarily based on AMD measured testing as of 6/2/2022. Configurations: 2x 96-core AMD 4th Gen EPYC (pre-production silicon) on a reference system versus 2x 64-core EPYC 7763 on a reference system. Java model JDK18.To slot in demo time permitted, the total server-side Java run that usually takes about 20 minutes was diminished to a short-preset time the place each techniques have been working at 99% CPU utilization, eliminating the “heat up” interval information. OEM revealed scores will differ primarily based on system configuration and use of manufacturing silicon.
7 SP5-006: 128-core 4th Gen EPYC CPUs in comparison with a 64-core third Gen EPYC 7763 for 2x the container density
8 “Technical Computing” or “Technical Computing Workloads” as outlined by AMD can embrace: digital design automation, computational fluid dynamics, finite factor evaluation, seismic tomography, climate forecasting, quantum mechanics, local weather analysis, molecular modeling, or comparable workloads. GD-204
9 MI300-03 – Measurements by AMD Efficiency Labs June 4, 2022 on present specification and/or estimation for delivered FP8 floating level efficiency with construction sparsity supported for AMD Intuition™ MI300 vs. MI250X FP16 (306.4 estimated delivered TFLOPS primarily based on 80% of peak theoretical floating-point efficiency). MI300 efficiency primarily based on preliminary estimates and expectations. Ultimate efficiency could differ. MI300-03
10 Z4-005: Testing as of Might 5, 2022, by AMD Efficiency Labs. Single-thread efficiency evaluated with Cinebench R23 1T. AMD Ryzen 9 5950X System: ASUS ROG Crosshair VIII Hero X570, 2×8 DDR4-3600C16. AMD Ryzen 7000 Collection: AMD Reference X670 Motherboard, Ryzen 7000 Collection 16-core pre-production processor pattern, 2x16GB DDR5-6000CL30. All techniques configured with Radeon™ RX 6950XT GPU (driver: 22.10 Prime), Home windows 11 Construct 22000.593, Samsung 980 Professional 1TB SSD, Asetek 280MM liquid cooler.
Testing as of Might 31, 2022 by AMD efficiency labs. Multi-thread efficiency evaluated with Cinebench R23 1T. AMD Ryzen 9 5950X System: AMD Reference X570 Motherboard, 2×8 DDR4-3200. AMD Ryzen 7000 Collection: AMD Reference X670 Motherboard, Ryzen 7000 Collection 16-core pre-production processor pattern, 2x16GB DDR5-5200. All techniques configured with Radeon™ RX 6950XT GPU (driver: 22.10 Prime), Home windows 11 Construct 22000.593, Samsung 980 Professional 1TB SSD, Asetek 280MM liquid cooler
Outcomes could differ when last merchandise are launched in market.

Contact:
Drew Prairie
AMD Communications
(512) 602-4425
[email protected]

Laura Graves
AMD Investor Relations
(408) 306-9157
[email protected]

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